10 - 12 September, 2019
Munich Marriott Hotel, München, Germany

Agenda Day 2

Agenda Day 1 Agenda Day 2 Workshop Day

Morning Session

8:50 am - 9:00 am Opening Remarks by the conference chairperman of the day, Dr. Martin Rittner

9:00 am - 9:40 am Automotive Wide-Band-Gap applications – impact on system and integration

Speaker:
Dr. Maximilian Hofmann Group Manager Drive Inverters and Mechatronics - Deputy Head of the department “Vehicle Power Electronics” Fraunhofer IISB

Dr. Maximilian Hofmann

Group Manager Drive Inverters and Mechatronics - Deputy Head of the department “Vehicle Power Electronics”
Fraunhofer IISB

See Bio

9:40 am - 10:20 am Solutions for high-efficiency HV inverter

Speaker:
Dr. Philip Brockerhoff System Engineer Continental

Dr. Philip Brockerhoff

System Engineer
Continental

See Bio

10:30 am - 11:00 am Morning coffee break

11:00 am - 11:40 am Design and development of SiC drive for in-wheel motor applications

Speaker:
Dr. Chao Ji Power Electronics Research Engineer Protean Electric

Dr. Chao Ji

Power Electronics Research Engineer
Protean Electric

See Bio

Morning Session 2

11:40 am - 12:20 pm Temperature cycling test for power electronics units subject to a very large number of power cycles in the field

Speaker:
Andre Kleyner Global Reliability Engineering Leader Aptiv

Andre Kleyner

Global Reliability Engineering Leader
Aptiv

See Bio

12:20 pm - 1:50 pm Networking luncheon

Round Table Sessions

Table A

1:50 pm - 2:50 pm New cost efficient power module cooling methods

Moderator:
Dr. Simon Hart CTO (Controllers and Power Electronics) YASA

Dr. Simon Hart

CTO (Controllers and Power Electronics)
YASA

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Table B

1:50 pm - 2:50 pm New materials and interconnection technologies for high temperature resistant power packaging

Table C

1:50 pm - 2:50 pm Moving to 800V

Round Table Sessions

2:50 pm - 3:20 pm Discussion of the round table sessions

3:20 pm - 3:50 pm Afternoon coffee break

Afternoon Session

3:50 pm - 4:30 pm All sintered double side cooled power semiconductor module for EV/HEV

Speaker:
Dr. Yangang Want Senior Director DRC Dynex Semiconductor Ltd.

Dr. Yangang Want

Senior Director DRC
Dynex Semiconductor Ltd.

See Bio

4:30 pm - 5:10 pm Developments in reliability of SiC devices in automotive applications

Speaker:
Aly Mashaly Manager Power Systems ROHM Semiconductor Europe

Aly Mashaly

Manager Power Systems
ROHM Semiconductor Europe

See Bio

Agenda Day 2

Morning Session

8:50 am - 9:00 am Opening Remarks by the conference chairperman of the day, Dr. Martin Rittner

9:00 am - 9:40 am Automotive Wide-Band-Gap applications – impact on system and integration

Dr. Maximilian Hofmann

9:40 am - 10:20 am Solutions for high-efficiency HV inverter

Dr. Philip Brockerhoff

10:30 am - 11:00 am Morning coffee break

11:00 am - 11:40 am Design and development of SiC drive for in-wheel motor applications

Dr. Chao Ji

Morning Session 2

11:40 am - 12:20 pm Temperature cycling test for power electronics units subject to a very large number of power cycles in the field

Andre Kleyner

12:20 pm - 1:50 pm Networking luncheon

Round Table Sessions

Table A

Dr. Simon Hart

Table B

Table C

Round Table Sessions

2:50 pm - 3:20 pm Discussion of the round table sessions

3:20 pm - 3:50 pm Afternoon coffee break

Afternoon Session

3:50 pm - 4:30 pm All sintered double side cooled power semiconductor module for EV/HEV

Dr. Yangang Want

4:30 pm - 5:10 pm Developments in reliability of SiC devices in automotive applications

Aly Mashaly

5:10 pm - 5:20 pm Closing remarks by the conference chairman of the day, Dr. Martin Rittner

Evening Workshop

6:00 pm - 8:00 pm Workshop A: Innovative Packaging Solutions for WBG Power Electronics