10 - 12 September, 2019
Munich Marriott Hotel, München, Germany

Agenda Day 2

Morning Session

8:50 am - 9:00 am Opening Remarks by the conference chairperman of the day, Dr. Martin Rittner

9:00 am - 9:40 am Automotive Wide-Band-Gap applications – impact on system and integration

Dr. Maximilian Hofmann, Group Manager Drive Inverters and Mechatronics - Deputy Head of the department “Vehicle Power Electronics” at Fraunhofer IISB

Dr. Maximilian Hofmann

Group Manager Drive Inverters and Mechatronics - Deputy Head of the department “Vehicle Power Electronics”
Fraunhofer IISB

9:40 am - 10:20 am Solutions for high-efficiency HV inverter

Dr. Philip Brockerhoff, System Engineer at Continental

Dr. Philip Brockerhoff

System Engineer
Continental

10:30 am - 11:00 am Morning coffee break

11:00 am - 11:40 am Design and development of SiC drive for in-wheel motor applications

Dr. Chao Ji, Principal Power Electronics & Control Engineer at Protean Electric

Dr. Chao Ji

Principal Power Electronics & Control Engineer
Protean Electric

Round Table Sessions

Table A

11:40 am - 12:30 pm New cost efficient power module cooling methods
Dr. Simon Hart, CTO (Controllers and Power Electronics) at YASA

Dr. Simon Hart

CTO (Controllers and Power Electronics)
YASA

Table B

11:40 am - 12:30 pm New materials and interconnection technologies for high temperature resistant power packaging
Chris White, Engineering Manager, Power Device Division at Hitachi Europe

Chris White

Engineering Manager, Power Device Division
Hitachi Europe

Pradip Chatterjee, Senior Staff Engineer at Infineon Technologies

Pradip Chatterjee

Senior Staff Engineer
Infineon Technologies

Dr. Jon Salkeld, Technology Director, BP Advanced Mobility Unit at BP

Dr. Jon Salkeld

Technology Director, BP Advanced Mobility Unit
BP

Round Table Sessions

12:30 pm - 1:00 pm Discussion of the round table sessions

1:00 pm - 2:30 pm Networking luncheon

Afternoon Session

2:30 pm - 3:10 pm Temperature cycling test for power electronics units subject to a very large number of power cycles in the field

Andre Kleyner, Global Reliability Engineering Leader at Aptiv

Andre Kleyner

Global Reliability Engineering Leader
Aptiv

3:10 pm - 3:50 pm All sintered double side cooled power semiconductor module for EV/HEV

Dr. Yangang Wang, Senior Director DRC at Dynex Semiconductor Ltd.

Dr. Yangang Wang

Senior Director DRC
Dynex Semiconductor Ltd.

3:50 pm - 4:20 pm Afternoon coffee break

4:20 pm - 5:00 pm SiC MOSFETs technology and device reliability

Dr. Christian Felgemacher, Field Application Engineer at ROHM Semiconductor Europe

Dr. Christian Felgemacher

Field Application Engineer
ROHM Semiconductor Europe

5:00 pm - 5:10 pm Closing remarks by the conference chairman of the day, Dr. Martin Rittner

Evening Workshop

5:45 pm - 8:15 pm Workshop A: Innovative Packaging Solutions for WBG Power Electronics

Dr. Martin Rittner, Senior Expert Power Electronics Assembly and Interconnection Technologies at Robert Bosch GmbH

Dr. Martin Rittner

Senior Expert Power Electronics Assembly and Interconnection Technologies
Robert Bosch GmbH