Agenda Day 2
Morning Session
8:50 am - 9:00 am Opening Remarks by the conference chairperman of the day, Dr. Martin Rittner
9:00 am - 9:40 am Automotive Wide-Band-Gap applications – impact on system and integration
Dr. Maximilian Hofmann
Group Manager Drive Inverters and Mechatronics - Deputy Head of the department “Vehicle Power Electronics”Fraunhofer IISB
9:40 am - 10:20 am Solutions for high-efficiency HV inverter
10:30 am - 11:00 am Morning coffee break
11:00 am - 11:40 am Design and development of SiC drive for in-wheel motor applications
Round Table Sessions
Table A
11:40 am - 12:30 pm New cost efficient power module cooling methods
Table B
11:40 am - 12:30 pm New materials and interconnection technologies for high temperature resistant power packaging
Table C
11:40 am - 12:30 pm Moving to 800V
Round Table Sessions
12:30 pm - 1:00 pm Discussion of the round table sessions
1:00 pm - 2:30 pm Networking luncheon
Afternoon Session
2:30 pm - 3:10 pm Temperature cycling test for power electronics units subject to a very large number of power cycles in the field
3:10 pm - 3:50 pm All sintered double side cooled power semiconductor module for EV/HEV
3:50 pm - 4:20 pm Afternoon coffee break
4:20 pm - 5:00 pm SiC MOSFETs technology and device reliability
5:00 pm - 5:10 pm Closing remarks by the conference chairman of the day, Dr. Martin Rittner
Evening Workshop
5:45 pm - 8:15 pm Workshop A: Innovative Packaging Solutions for WBG Power Electronics
Dr. Martin Rittner
Senior Expert Power Electronics Assembly and Interconnection TechnologiesRobert Bosch GmbH
