As functional safety culture grows automation become increasingly complex and new processes are needed. Read here how Intel develops a state of the art functional safety automation processes.
This event is presented by the experts of national and international members of ISO/TC22, from national to international voting members and ISO 26262 Part Leaders, in a one of a kind four day event. Here is the easiest and fastest way to register.
With introduction of ISO 26262 Part 11, OEMs and IP integrators have to adapt to the new regulation and be compliant. Read how to achieve this here.
Read how Senior Safety and Cyber Security Engineers at Renesa discusses the relationship of automotive safety and security for the semiconductor industry.
Part 11 of the 2nd edition of ISO 26262 has started to focus on know-how exchange with respect to semiconductors. However, the complexity of systems requires special attention. What the industry’s challenges and how to overcome these? Read how Cypress Semiconductors challenges the implantation of the standard.
The processor industry is shaped by the introduction of trans-formative technologies, and semiconductors with complex “Systems on Chip” (SoC) are introduced to the market. In which technologies are semiconductor companies looking to invest? Read our article answering the question here.
Evaluation of design tools required level of confidence is a required step in the safety process. The confidence level may lead to the necessity of qualifying those tools whose failure may have significant, and difficult to detect, impacts on safety. This process is often addressed late and teams are often faced with unexpected tasks and costs.
To prevent the unexpected, read this Intel presentation on Design Tools Classification and Qualification in a Safety Related Environment.
The second edition of ISO 26262 Part 11 shares guidelines on the application of the standard to semiconductors, but how useful has it been proven to semiconductor companies? Read an answer to this question in our expert interview with Lisa Clark, Senior Functional Safety manager at Veoneer here.
In recent years, autonomous driving vehicles have become one of the hottest topics in the automotive world. Everyday consumers and electronics professionals are both fascinated by the promise and the risks of autonomous vehicles.
Existing automotive semiconductor companies as well as new entrants are making significant investments in this area developing new high performance, feature rich and power optimized system-on-chip (SoC) designs. Some of these development teams may be unfamiliar with the unique requirements of the automotive market, specifically compliance to the ISO 26262 standard for functional safety.
In the past, cars made us mobile, but today’s cars are becoming mobile devices themselves. More than a means of transportation, cars are evolving into complete mobile devices--connecting and connected to the internet, transportation grids, and to each other. MIPI specifications are playing an important role in this transformation just as they have played the key role in unifying the interfaces in the most common mobile device of all – the smartphone.
OEM’s have focused on creating highest-speed, safe and fuel-efficient cars. As such, car manufactures looking for new technologies and features for cameras and sensors. The progression toward Autonomous Driving Systems (ADS) has supported the use of onboard cameras and sensors for Advanced Driver-Assisted Systems (ADAS). How does Mixel implement these new systems and technologies to balance the industry’s need for low power and stringent safety testing. Download the whitepaper to find out more.