In the midst of the rapid push toward autonomous driving, the IP of SoCs has become a critical aspect as chip requirements keep changing to support new applications. With the introduction of ISO 26262 Part 11, OEMs and IP integrators are looking for quality, dependability and functional safety, but have to adapt to the new regulation and be compliant. The most critical aspects of IP and other Part 11 aspects will be discussed by top speakers at IQPC’s ISO 26262 Part 11 to Semiconductors conference in Detroit.
The first edition of ISO 26262 was not dedicated to the development of semiconductors, but as more safety mechanisms are implemented at IC and IP level, Part 11 attempts at closing this gap. However, semiconductor companies face critical obstacles regarding high integrity levels of security while continually trying to reduce SoC time to market, offer value and remain cost efficient. What are these challengesand how can semiconductor companies prepare to overcome them?
Implementing ISO 26262 for Semiconductors is expensive in terms of staff training, external assessment, and other neuralgic aspects. However, they can bridge the cost gap through innovation, developing smarter testing methods, and a multi-disciplinary approach to quality in which process control is a predominant success factor. The latest approaches to cost-efficient Functional Safety will be discussed at IQPC’s ISO 26262 for Semiconductors USA Conference this year.