Expert interview on developments in power electronics packaging including 3D integrated packaging

Expert interview on developments in power electronics packaging including 3D integrated packaging

What does the future hold here? What potential does 3D integrated packaging? How reliable is the packaging of Si power components?

Expand your knowledge on this topic with this exclusive interview with Prof. Dr. Matthias Petzold, Head of Fraunhofer Center for Applied Microstructure Diagnostics at Fraunhofer IMWS in Germany who answers these pressing questions. 

Download the full interview for free here.


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