September 30 - October 02, 2019 | INTERCONTINENTAL STEPHEN F. AUSTIN, Austin, TX
Conference Day Two
Opening
8:30 am - 9:00 am Registration and Welcome Coffee
9:00 am - 9:10 am Chairperson's opening remarks
JOINT SESSION WITH PROFESSIONALS FROM SOTIF
9:10 am - 9:50 am Keynote Opening Presentation: The Impact of ISO/PAS 21448 SOTIF on the Semiconductor Industry
Part 11, solely focusing on the semiconductor industry, was just recently added to the ISO 26262 standard. This speech focusses on the impact the ISO/PAS 21448 will have on the semiconductor industry, e.g. on sensors verification and validation. Riccardo Mariani, leader of ISO26262 part 11, explains if SOTIF will also need or not a dedicated chapter or annex on semiconductors. In this case, Riccardo is represented by his colleague Frank Noha.
9:50 am - 10:30 am Leveraging deep neural networks to ensure autonomous vehicle safety
This presentation will specifically delve into how the integration of Deep Neural Networks
(DNNs) for autonomous driving is impacting traditional development approaches, and how
OEMs, Tier1s, and Tier2s can work together to build safer AVs through DNNs.
• Role of DNNs in autonomous driving
• Traditional development approach
• OEM/Tier1/Tier2 collaboration challenges ( Performance and safety optimization for complex hardware, DNN training, Adaptation of trained DNNs for new vehicles, DNN compliance with SOTIF, V&V of DNNs)
• Future challenges
Process Excellence
10:30 am - 11:10 am A new collaborative approach to defectivity challenges in the automotive industry
• The automotive semiconductor requirements as defined by the car maker
• The Global Automotive Advisory Council (GAAC), a global engagement platform
• A collaborative engagement model between device makers and material purity experts for an improved defectivity
11:10 am - 11:40 am Coffee break and networking
11:40 am - 12:20 pm Panel Discussion | External Manufacturing Partnerships
Discussion between Tiers 1, Semiconductor companies, OEMs
• Partners as critical components of the manufacturing strategy
• Rigorous supplier assessments: Quality standards – monitoring – improvement program for zero defect strategy
12:20 pm - 12:50 pm Telemetry for Reliability and Safety
• Motivation and Telemetry Framework
• Prognostics / Predictive Failure
• Metrics / Capabilities
• Anomaly Detection
• Field Data Studies
12:20 pm - 1:00 pm Approaches for Semiconductor Front End Operations
Tier 1 suppliers to the Automotive market require zero defects from their semiconductor component manufacturers. Achieving true zero defects challenges semiconductor manufacturers to continually expand their ability to quickly and cost effectively identify outliers. Discussion of two exploratory approaches to complement the suite of tools commonly used to screen potential latent defects. Focus areas in this presentation include:
- Utilizing machine learning to correlate the characteristics of measured defects and mapped test responses to generate statistics that predict failure probability.
- Applying big data analytics techniques to the enormous volume of fab in-line and wafer test data to rapidly identify and correct root causes of observed variations that could lead to latent failures.
1:30 pm - 3:00 pm Networking luncheon
3:00 pm - 3:40 pm Validation
• Test characterization
• Design validation for reliable performance over the application range of electrical and environmental conditions
• Goals for yield and throughput
• Life cycle: The Big Picture
3:40 pm - 4:20 pm Expectations on zero defect practice and impact to semiconductor quality
4:20 pm - 4:50 pm Refreshment break
3:40 pm - 4:20 pm Round Table I: Change Management: Product/Process Change Notice (PCN)
• 33 percent of failures are due to PCN
• PCN: What information do they have to contain?
3:40 pm - 4:20 pm Round Table II: Supporting Zero Defect
5:20 pm - 5:40 pm Q&A | Focusing on automative safety and reliability requirements
Q&A with the speakers