September 30 - October 02, 2019 | INTERCONTINENTAL STEPHEN F. AUSTIN, Austin, TX

Conference Day Two

Opening

8:30 am - 9:00 am Registration and Welcome Coffee

9:00 am - 9:10 am Chairperson's opening remarks

Carol Farber, Product Safety Leader Electromobility GPE Wheel Loaders at Volvo CE

Carol Farber

Product Safety Leader Electromobility GPE Wheel Loaders
Volvo CE

JOINT SESSION WITH PROFESSIONALS FROM SOTIF

9:10 am - 9:50 am Keynote Opening Presentation: The Impact of ISO/PAS 21448 SOTIF on the Semiconductor Industry

Part 11, solely focusing on the semiconductor industry, was just recently added to the ISO 26262 standard. This speech focusses on the impact the ISO/PAS 21448 will have on the semiconductor industry, e.g. on sensors verification and validation. Riccardo Mariani, leader of ISO26262 part 11, explains if SOTIF will also need or not a dedicated chapter or annex on semiconductors. In this case, Riccardo is represented by his colleague Frank Noha.
Frank Noha, Safety Specialist at NVIDIA, USA

Frank Noha

Safety Specialist
NVIDIA, USA

9:50 am - 10:30 am Leveraging deep neural networks to ensure autonomous vehicle safety

This presentation will specifically delve into how the integration of Deep Neural Networks
(DNNs) for autonomous driving is impacting traditional development approaches, and how
OEMs, Tier1s, and Tier2s can work together to build safer AVs through DNNs.
• Role of DNNs in autonomous driving
• Traditional development approach
• OEM/Tier1/Tier2 collaboration challenges ( Performance and safety optimization for complex hardware, DNN training, Adaptation of trained DNNs for new vehicles, DNN compliance with SOTIF, V&V of DNNs)
• Future challenges
Frank Noha, Safety Specialist at NVIDIA, USA

Frank Noha

Safety Specialist
NVIDIA, USA

Process Excellence


10:30 am - 11:10 am A new collaborative approach to defectivity challenges in the automotive industry

• The automotive semiconductor requirements as defined by the car maker
• The Global Automotive Advisory Council (GAAC), a global engagement platform
• A collaborative engagement model between device makers and material purity experts for an improved defectivity
Wenge Yang, VP Market Strategy & Member GAAC, North America Chapter at Entegris

Wenge Yang

VP Market Strategy & Member GAAC, North America Chapter
Entegris

11:10 am - 11:40 am Coffee break and networking

Discussion between Tiers 1, Semiconductor companies, OEMs
• Partners as critical components of the manufacturing strategy
• Rigorous supplier assessments: Quality standards – monitoring – improvement program for zero defect strategy
Joyce Witowski, Director Manufacturing Quality at NXP Semiconductors Inc.

Joyce Witowski

Director Manufacturing Quality
NXP Semiconductors Inc.

Wenge Yang, VP Market Strategy & Member GAAC, North America Chapter at Entegris

Wenge Yang

VP Market Strategy & Member GAAC, North America Chapter
Entegris

Peter Welti, Global Supplier Development Engineer at ZF

Peter Welti

Global Supplier Development Engineer
ZF

12:20 pm - 12:50 pm Telemetry for Reliability and Safety

• Motivation and Telemetry Framework
• Prognostics / Predictive Failure
• Metrics / Capabilities
• Anomaly Detection
• Field Data Studies
Jyotika Athavale, Senior Staff Reliability Architect at Intel

Jyotika Athavale

Senior Staff Reliability Architect
Intel

12:20 pm - 1:00 pm Approaches for Semiconductor Front End Operations

Tier 1 suppliers to the Automotive market require zero defects from their semiconductor component manufacturers. Achieving true zero defects challenges semiconductor manufacturers to continually expand their ability to quickly and cost effectively identify outliers. Discussion of two exploratory approaches to complement the suite of tools commonly used to screen potential latent defects. Focus areas in this presentation include:

  • Utilizing machine learning to correlate the characteristics of measured defects and mapped test responses to generate statistics that predict failure probability.
  • Applying big data analytics techniques to the enormous volume of fab in-line and wafer test data to rapidly identify and correct root causes of observed variations that could lead to latent failures.
Joyce Witowski, Director Manufacturing Quality at NXP Semiconductors Inc.

Joyce Witowski

Director Manufacturing Quality
NXP Semiconductors Inc.

1:30 pm - 3:00 pm Networking luncheon

3:00 pm - 3:40 pm Validation

• Test characterization
• Design validation for reliable performance over the application range of electrical and environmental conditions
• Goals for yield and throughput
• Life cycle: The Big Picture
Nikhil Patil, Product Development at Intel

Nikhil Patil

Product Development
Intel

3:40 pm - 4:20 pm Expectations on zero defect practice and impact to semiconductor quality

Peter Welti, Global Supplier Development Engineer at ZF

Peter Welti

Global Supplier Development Engineer
ZF

4:20 pm - 4:50 pm Refreshment break

3:40 pm - 4:20 pm Round Table I: Change Management: Product/Process Change Notice (PCN)

• 33 percent of failures are due to PCN
• PCN: What information do they have to contain?
Jyotika Athavale, Senior Staff Reliability Architect at Intel

Jyotika Athavale

Senior Staff Reliability Architect
Intel

3:40 pm - 4:20 pm Round Table II: Supporting Zero Defect

Nicholas Balderson, Director Fab1 Quality at GlOBALFOUNDRIES, Inc

Nicholas Balderson

Director Fab1 Quality
GlOBALFOUNDRIES, Inc

5:20 pm - 5:40 pm Q&A | Focusing on automative safety and reliability requirements

Q&A with the speakers

5:40 pm - 5:50 pm Chairperson's closing remarks

Carol Farber, Product Safety Leader Electromobility GPE Wheel Loaders at Volvo CE

Carol Farber

Product Safety Leader Electromobility GPE Wheel Loaders
Volvo CE