Giovanni Boldrini

Certified Mechanical Design Engineer Aavid, Thermal Division of Boyd Corporation

Agenda Day 1

Tuesday, February 11th, 2020

2:20 PM High-performance cooling solutions for complex electronics systems

Design practices and materials to achieve efficient packaging
• Thermal management solutions, from aluminum and steel liquid cold plates to heat pipes, vapor
chambers, and encapsulated APG
• Polyimide foam technology from NASA for robust packaging that resists flames, damps noise,
contains thermal runaway, and provides isolation from the environment

Check out the incredible speaker line-up to see who will be joining Giovanni.

Download The Latest Agenda