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Automotive IQ Article: ISO26262 Part 11 - FuSa Challenges for Semiconductors

Automotive IQ Article: ISO26262 Part 11 - FuSa Challenges for Semiconductors

The first edition of ISO 26262 was not dedicated to the development of semiconductors, but as more safety mechanisms are implemented at IC and IP level, Part 11 attempts at closing this gap. However, semiconductor companies face critical obstacles regarding high integrity levels of security while continually trying to reduce SoC time to market, offer value and remain cost efficient. What are these challengesand how can semiconductor companies prepare to overcome them?

Automotive IQ Article: Reducing Costs when Implementing ISO 26262 Part 11

Automotive IQ Article: Reducing Costs when Implementing ISO 26262 Part 11

Implementing ISO 26262 for Semiconductors is expensive in terms of staff training, external assessment, and other neuralgic aspects. However, they can bridge the cost gap through innovation, developing smarter testing methods, and a multi-disciplinary approach to quality in which process control is a predominant success factor. The latest approaches to cost-efficient Functional Safety will be discussed at IQPC’s ISO 26262 for Semiconductors USA Conference this year.