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Guidance of ISO 26262 for Semiconductors - Conference Agenda

Guidance of ISO 26262 for Semiconductors15 – 18 JUNE 2020 | DETROIT, MI26+ SPEAKERS | UNLIMITED NETWORKING | INTERACTIVE SESSIONSThis event is designed and presented by the expertise of national and international members of ISO/TC22 and ISO 26262 Part Leaders.

Presentations

Intel Presentation: Optimizing IP Integration and Reuse

This presentation was prepared by Intel for the Conference on Guidance of ISO26262 for Semiconductors in Detroit, USA. The presentation covers:IP Assumptions of UseCompatibility of Safety MechanismsConfiguralibility of IP Safety MechanismsConsumability of IP Safety Analysis

Intel Presentation: Practical Application of ISO 26262 Part 11

Part 11 represents an adaptation of ISO 26262 specifically to semiconductor devices to facilitate the application of the standard’s requirements. However, semiconductor developers must address several key considerations in order to successfully apply Part 11 to their devices. This talk will address some of these considerations by way of example...

Veoneer Presentation: Practical Advice for Semiconductor Suppliers

In this presentation, Lisa Clark, Global Director Functional Safety at Veoneer, shares their advice for semiconductor suppliers concerning FMEDA. The presentation covers:FMEDA Format & Level of SupportComponent Failure and its IdentificationMixed Signals ICs & Critical FunctionsMultiple Safety MechanismsManaging Changes to the FMEDA

Articles & Reports

Automotive IQ Article: ISO26262 Part 11 - SOCS and the IP Conundrum

In the midst of the rapid push toward autonomous driving, the IP of SoCs has become a critical aspect as chip requirements keep changing to support new applications. With the introduction of ISO 26262 Part 11, OEMs and IP integrators are looking for quality, dependability and functional safety, but have...

Automotive IQ Article: ISO26262 Part 11 - FuSa Challenges for Semiconductors

The first edition of ISO 26262 was not dedicated to the development of semiconductors, but as more safety mechanisms are implemented at IC and IP level, Part 11 attempts at closing this gap. However, semiconductor companies face critical obstacles regarding high integrity levels of security while continually trying to reduce...

Automotive IQ Article: Reducing Costs when Implementing ISO 26262 Part 11

Implementing ISO 26262 for Semiconductors is expensive in terms of staff training, external assessment, and other neuralgic aspects. However, they can bridge the cost gap through innovation, developing smarter testing methods, and a multi-disciplinary approach to quality in which process control is a predominant success factor. The latest approaches to...

Interviews

Interview with Xilinx Expert on Ensuring Compliance to Part 11

Semiconductor companies face critical obstacles regarding high integrity levels of security while continually trying to reduce SoC time to market, offer value and remain cost efficient. Ahead of IQPC's ISO 26262 to Semiconductors in the US, Oscar Ballan from Xilinx explains some of the keys to a solid application of...

Interview with Intel Expert on the Keys to a Practical Application of Part 11

Part 11 represents an adaptation of ISO 26262 specifically to semiconductor devices to facilitate the application of the standard’s requirements. However, semiconductor developers must address several key considerations in order to successfully apply Part 11 to their devices. Gustavo Espinosa addresses some of these considerations by way of example of...

Interview with Jyotika Athavale from Intel on ISO 26262 for Semiconductors and System Level Radiation Testing for Safety Critical Platforms

Jyotila Athavale, Principal Engineer Senior Functional Safety and RAS Architect at Intel Corporation, explains how System Radiation Testing helps to accurately model transient reliability for safety critical platforms compared to the traditional methodology of bottom-up individual component characterization. Download this exclusive article to learn more. 

SPEX Exclusive Content

Partner Content - 3rd Int'l Conference Guidance of ISO 26262 to Semiconductors - Get the Info!

Safety for Automotive Semiconductors – Hardware & Software Safety with and Beyond ISO 26262: This event, co-located with our 7th International ISO 26262 USA Conference, is dedicated to Tier 1 suppliers and OEMs. Attendees of both conferences will enjoy all breaks and both evening get-togethers jointly. This offers you the...

Partner Content - Intel Presentation: The Practical Applications of ISO 26262 Part II

Traditionally, functional safety automation focused on the management of hardware failures and safety requirements. But as functional safety culture grows, automation become increasingly complex and new processes are needed. See how Intel developed a state of the art functional safety automation processes.Get more information on: What was needed and how...